Achieve precision, speed, and reliability with Symtrace Maschinen’s advanced Laser Depaneling Systems, engineered for high-performance PCB and electronics separation. Unlike traditional mechanical cutting methods, our laser depaneling technology offers stress-free, burr-free, and contactless processing, ensuring optimal protection for delicate components and high-density boards.

Whether you're handling rigid, flexible, or rigid-flex PCBs, our systems deliver micron-level accuracy with minimal thermal impact, making them ideal for industries such as automotive, medical devices, consumer electronics, and aerospace.

With full local support in Malaysia and Singapore, SYMTRACE provides consultation, customization, integration, and after-sales service to ensure seamless implementation into your production line.